Araca Incorporated is a start-up company founded in September 2004 by several individual and corporate investors. Our headquarters is in Tucson, Arizona with branch offices in Mesa, Arizona and Mie, Japan.

We provide unique, enabling and fully customized solutions to our clients in the integrated circuit planarization and semiconductor polishing fields worldwide.

We are committed to providing the following services to our clients related to 300, 200, and 100-mm processes and platforms:

• Pad surface preparation, grooving, lamination, QC, final packaging and distribution.
• Analytical and functional testing of consumables (i.e.pads, slurries, post-CMP cleaning brushes, diamond discs and retaining rings).
• Process physics and simulation.
• Process development.

We manufacture, in collaboration with Fujikoshi Machinery Corporation (Nagano, Japan), state-of-the-art 200 and 300-mm polishers capable of real-time measurement, analysis, correlation and reporting of shear force and down force.

We also manufacture fully-instrumented testers for characterizing asperity-level mechanical properties of pads and cleaning brushes, as well as, ultra-compact, fully-instrumented, pad sample holders for laser confocal microscopy.

We are the exclusive sales agent, in North America and Europe, of patented surface preparation and pad grooving CNC machines manufactured by Toho Engineering (Mie, Japan).

Our clients include leading consumables suppliers, CMP tool manufacturers, universities, research centers and end-users.