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Company History and Announcements

  • September 2008 – Araca Incorporated reaches a major IP milestone by filing its twentieth patent application.
  • August 2008 – Tohoku University (Sendai, Japan) and Araca Incorporated enter into a new 9-month Joint Development Program to develop low stress copper and barrier CMP processes for integration into Ohmi Lab’s advanced LSI process flow.
  • April 2008 – Araca Incorporated reaches a major IP milestone by filing its tenth patent application.
  • February 2008 – Araca Incorporated introduces surface preparation and grooving services for 43-inch diameter pads.
  • January 2008 – Tohoku University (Sendai, Japan) and Araca Incorporated enter into a 6-month Joint Development Program to develop advanced copper and barrier CMP processes for integration into Ohmi Lab’s advanced LSI process flow.
  • November 2007 – Araca Incorporated takes a strategic equity position in InfoNeedle Incorporated (creator of SemiNeedle, a gated professional community web site for semiconductor professionals).
  • October 2007 – Araca Incorporated enters into an 8-month Joint Feasibility Study with a major CMP slurry manufacturer to investigate the feasibility of using a novel class of copper CMP slurries for the 32 nm node and beyond.
  • September 2007 – Araca Incorporated introduces PHD – 100: An ultra-compact, fully-instrumented, pad sample holder for laser confocal microscopy.
  • July 2007 – Araca Incorporated introduces ILD – 100: A fully-instrumented tester for characterizing asperity-level mechanical properties of pads and cleaning brushes.
  • May 2007 – Araca Incorporated adds laser confocal microscopy to its list of analytical services.
  • January 2007 – Araca Incorporated introduces APD – 800: The world’s first 300-mm polisher capable of real-time measurement, analysis, correlation and reporting of force in three dimensions.
  • November 2006 – Araca Incorporated becomes a corporate member of the Center for Materials and Devices for Information Technology Research: An NSF Science and Technology Center.
  • April 2006 – Hitachi Chemical Co., Ltd, (Tokyo, Japan) takes a strategic equity position in Araca Incorporated .
  • April 2006 – Fujikoshi Machinery Corporation (Nagano, Japan) takes a further strategic equity position in Araca Incorporated.
  • April 2006 – 3rd round of financing is completed.
  • April 2006 – Araca Incorporated becomes a Nevada corporation.
  • February 2006 – Araca Incorporated and Hanyang University (Korea) sign a memorandum of understanding to promote cooperation in research and education in the area of planarization.
  • December 2005 – Araca Incorporated introduces APD – 500: The world’s first 200-mm polisher capable of real-time measurement, analysis, correlation and reporting of force in three dimensions.
  • June 2005 – University of Arizona authorizes and permits Araca Incorporated the contractual use of UA facilities to further its business objectives.
  • April 2005 – Fujikoshi Machinery Corporation takes a strategic equity position in Araca Incorporated.
  • April 2005 – 2nd round of financing is completed.
  • March 2005 – Araca Incorporated opens its second branch office in Mesa, AZ, USA.
  • March 2005 – Araca Incorporated completes the acquisition of Intelligent Planar (Mesa, AZ).
  • December 2004 – Araca Incorporated opens its first branch office in Mie, Japan.
  • October 2004 – Araca Incorporated becomes the exclusive sales agent, in North America and Europe, of patented surface preparation and pad grooving services provided by, and CNC machines manufactured by, Toho Engineering (Mie, Japan).
  • October 2004 – 1st round of financing is completed.
  • September 2004 – Araca Incorporated is founded as a Delaware corporation operating from its headquarters in Tucson, AZ, USA.

Upcoming Events

  • April 13-17 (2009) – 2009 Materials Research Society Spring Meeting, San Francisco, CA, USA.
  • December 3-5 (2008) – SEMICON Japan 2008, Makuhari Messe, Chiba, Japan.

Past Events

  • November 10-12 (2008) – International Conference on Planarization/CMP Technology 2008 (ICPT 2008), Hsinchu, Taiwan.
  • September 22-24 (2008) – Ultra Clean Processing of Semiconductor Surfaces (UCPSS), Brugge, Belgium.
  • August 13-16 (2008) – The 11th International Chemical-Mechanical Planarization (CMP) Symposium, Lake Placid, New York, USA.
  • July 15-17 (2008) – SEMICON West 2008, San Francisco, CA, USA.
  • April 9 (2008) – CMP Users Group Announcements, Sunnyvale, CA, USA.
  • March 15-17 (2008) – The 7th International Semiconductor Technology Conference (ISTC2008), Pudong, Shanghai, China.
  • March 4-6 (2008) – 13th International Conference on Chemical-Mechanical Polishing (CMP) Planarization for ULSI Multilevel Interconnection, Fremont, CA, USA.
  • February 18 (2008) – 2008 Industrial Affiliates Program Exposition for the Center on Materials and Devices for Information Technology Research, Atlanta, GA, USA.
  • February 12 (2008) – CMP Users Conference, Santa Clara, CA, USA.
  • December 5-7 (2007) – SEMICON Japan 2007, Makuhari Messe, Chiba, Japan.
  • October 25-27 (2007) – 2007 International Conference on Planarization Technology, Dresden, Germany.
  • October 23-25 (2007) – 4th ISMI Symposium on Manufacturing Effectiveness, Austin, Texas, USA.
  • September 24-27 (2007) – 24th International VLSI/ULSI Multilevel Interconnection Conference, Fremont, CA, USA.
  • September 10-12 (2007) – SRC 9th Premier TECHCON 2007, Austin, Texas, USA.
  • August 12-15 (2007) – 12th International Symposium on Chemical-Mechanical Planarization, Lake Placid, NY, USA.
  • April 9-13 (2007) – 2007 Materials Research Society Spring Meeting, San Francisco, CA, USA.
  • March 5-8 (2007) – 12th International Conference on Chemical-Mechanical Polishing (CMP) Planarization for ULSI Multilevel Interconnection, Fremont, CA, USA.
  • October 29 - November 3 (2006) – 210th Meeting of The Electrochemical Society, Cancun, Mexico.
  • October 12-13 (2006) – 2006 International Conference on Planarization Technology, Foster City, CA, USA.
  • August 13-16 (2006) – 11th International Symposium on Chemical-Mechanical Planarization, Lake Placid, NY, USA.
  • April 7 (2006) – 16th CMP Users Meeting, Semicon Europe 2006, Munich, Germany.
  • February 20-23 (2006) – 11th International Conference on Chemical-Mechanical Polishing (CMP) Planarization for ULSI Multilevel Interconnection, Fremont, CA, USA.
  • November 17-19 (2005) – 2nd Pac-Rim International Conference on Planarization CMP and Its Application Technology, Seoul, Korea.
  • October 24-26 (2005) – SRC 8th Premier TECHCON 2005, Portland, Oregon, USA.
  • October 5 (2005) – Northern California Chapter AVS 10th International CMP User Group Symposium, San Jose, CA, USA.
  • October 3-6 (2005) – 22nd International VLSI Multilevel Interconnection Conference, Fremont, CA, USA.
  • August 14-17 (2005) – 10th International Symposium on Chemical-Mechanical Planarization, Lake Placid, NY, USA.
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