APD – 500 is a world-class 200-mm polisher capable of real-time measurement, analysis, correlation and reporting of shear force and down force. Smaller size wafers can also be polished with APD – 500 with some minimal hardware modification taking less than 5 minutes.

Manufactured in Japan by Fujikoshi Machinery Corporation, APD – 500 is powered by Araca’s FSX™ – 500 proprietary force acquisition and data analysis system with a superb graphic user interface including calibration, data acquisition, waveform analysis, spectral analysis and correlation menus.

The single-platen CMP and silicon polishing tool is intended for use in research and development environments at universities, research institutes and consumables suppliers worldwide. Additionally, it has proven to be indispensable for slurry QC applications where functional tests are required.

The system is equipped with shear force and down force sensors, removable platen, adjustable pad surface temperature sensor, air cylinder actuated wafer and diamond conditioner down force assemblies, 10-zone diamond conditioning arm, three independent computer-controlled 20-liter slurry and chemical delivery systems, and a myriad of other standard features.

Within-wafer removal rate non-uniformity (WIWRRNU) for ILD, tungsten, copper and tantalum applications are less than 9 percent (1-sigma, 5-mm edge exclusion). Run-to-run non-uniformity values of average removal rate, WIWRRNU, average shear force, average down force and average pad temperature are less than 2 percent.

Araca Incorporated is the exclusive worldwide sales agent of APD – 500.

Please refer to our APD – 500 Brochure for details on the various features and capabilities of the tool along with our latest product specifications.