When it comes to CMP consumables, pads are the second highest component of cost of ownership (COO). In research and development, to understand the interactions amongst various CMP consumables, one must test multiple pads, slurries and conditioning discs in a given design of experiment (DOE). It is relatively easy to replace one slurry (or disc) with another, since neither operation is destructive to the slurry (or disc) being replaced. On the other hand, pad replacement is a destructive, and time consuming, process thus making such an operation quite expensive and impractical on a day-to-day basis.

Araca’s RP-100 is a patented device for rendering all types of CMP polishing pads easily and temporarily removable from, and replaceable upon, the platen of typical CMP polisher. The device allows for easy removal and storage of the pad (which is attached to a removable top plate sitting upon the polisher’s main platen) at different stages of use without causing any damage to the pad or the polisher. The pad assembly may then be put back into service at any time thus significantly reducing the COO associated with testing of multiple pads on one platen.

RP-100 has additional advantages as noted below:

• Pads can be removed intact for surface metrology purposes such as white light interferometry (which can easily handle entire pads), geometric features (such as pad and groove thickness measurements) and slurry residue and by-products inspection.
• The transparency of the top plate allows users to prevent formation of bubbles in the adhesive which holds the pad onto the plate thus avoiding significant degradation of the CMP process performance.

Due to several IP sensitivities relating to the RP-100, additional information will be furnished to interested parties only after the execution of Araca’s standard mutual NDA. Please Contact Us for more details.