Top Background


Publications

Publications

Archival Journals

  • Analysis of Pads with Slanted Grooves for Copper CMP. D. Rosales-Yeomans, D. DeNardis, L. Borucki, T. Suzuki, and A. Philipossian. Journal of The Electrochemical Society, 155 (10) H750-H763 (2008).
  • Design and Evaluation of Pad Grooves for Copper CMP. D. Rosales-Yeomans, D. DeNardis, L. Borucki and A. Philipossian. Journal of The Electrochemical Society, 155 (10), H797-H806 (2008).
  • Evaluation of Pad Groove Designs under Reduced Slurry Flow Rate Conditions during Copper CMP. D. Rosales-Yeomans, D. DeNardis, L. Borucki, T. Suzuki, Y. Sampurno and A. Philipossian. Journal of The Electrochemical Society, 155 (10) H812-H818 (2008).
  • Feasibility of Real-time Detection of Abnormality in Inter Layer Dielectric Slurry During Chemical Mechanical Planarization using Frictional Analysis. Y. Sampurno, F. Sudargho, Y. Zhuang, M. Goldstein and A. Philipossian. Thin Solid Films, 516, 7667–7674 (2008).
  • Experimental and Numerical Analysis of a Novel Ceria Based Abrasive Slurry for Interlayer Dielectric Chemical Mechanical Planarization. Y. Zhuang, L. Borucki, E. Dien, M. Ennahali, G. Michel, B. Laborie, M. Keswani, D. Rosales-Yeomans, H. Lee and A. Philipossian. Transactions on Electrical and Electronic Materials, 8(2), 53-57 (2007).
  • Thermal, Tribological, and Removal Rate Characteristics of Pad Conditioning in Copper CMP. H. Lee, D. DeNardis, A. Philipossian, Y. Seike, M. Takaoka, K. Miyachi, S. Furukawa, A. Terada, Y. Zhuang and L. Borucki. Transactions on Electrical and Electronic Materials, 8(2), 67-72 (2007).
  • Physics of the Coefficient of Friction in CMP. L. Borucki, A. Philipossian and Y. Zhuang. Transactions on Electrical and Electronic Materials, 8(2), 79-83 (2007).
  • Study of Inhibition Characteristics of Slurry Additives in Copper CMP Using Force Spectroscopy. H. Lee, S. V. Babu, U. B. Patri, Y. Hong, L. Economikos, M. Goldstein and A. Philipossian. Transactions on Electrical and Electronic Materials, 8(1), 5-10 (2007).
  • Diamond Conditioner Wear Characterization for a Copper CMP Process. L. Borucki, Y. Zhuang, A. Philipossian, R. Kikuma, R. Rikita, T. Yamashita, K. Nagasawa, H. Lee, T. Sun, D. Rosales-Yeomans and T. Stout. Transactions on Electrical and Electronic Materials, 8(1), 15-20 (2007).
  • Development of a Pad Conditioning Method for ILD CMP using a High pressure Micro Jet System. H. Lee, D. DeNardis, A. Philipossian, Y. Seike, M. Takaoka, K. Miyachi and T. Doi. Transactions on Electrical and Electronic Materials, 8(1), 26-31 (2007).
  • Characterization of Slurry Residues in Pad Grooves for Diamond Disc and High Pressure Micro Jet Pad Conditioning Processes. H. Lee, Y. Seike, Z. Li, Y. Zhuang, M. Takaoka, K. Miyachi and A. Philipossian. Japanese Journal of Applied Physics, 45(50), L1325-L1327 (2006).
  • Characterization of Copper - Hydrogen Peroxide Film Growth Kinetics. D. DeNardis, D. Rosales-Yeomans, L. Borucki and A. Philipossian. Thin Solid Films, 513(1-2), 311-318 (2006).
  • Effects of Design and Kinematics of Conditioners on Process Hydrodynamics during Copper CMP. Z. Li, H. Lee, L. Borucki, C. Rogers, R. Kikuma, S. Rikita, I. Nagasawa and A. Philipossian. Journal of The Electrochemical Society, 153(5), G399-G404 (2006).
  • Implications of Wafer-Size Scale-up on Frictional, Thermal and Kinetic Attributes of ILD CMP Process. D. Rosales-Yeomans, L. Borucki, T. Doi, L. Lujan and A. Philipossian. Journal of The Electrochemical Society, 153(4), G272-G277 (2006).
  • Effect of Slurry Injection Position on Slurry Mixing, Friction, Removal Rate and Temperature in Copper CMP. Y. Sampurno, L. Borucki and A. Philipossian. Journal of The Electrochemical Society, 152 (11), G841-G845 (2005).

Conference Proceedings

  • Effect of Retaining Ring Slot Design on Slurry Flow during Chemical Mechanical Planarization Y Zhuang, X. Wei, R. Dittler, J. Cheng, C. Wargo, R. Stankowski and A. Philipossian. International Conference on Planarization/CMP Technology Proceedings, 74-79 (2008).
  • Analyses of Diamond Disc Substrate Wear and Diamond Micro-Wear in Copper Chemical Mechanical Planarization Process Y. Zhuang, A. Meled, X. Wei, J.Cheng, Y. Sampurno, L. Borucki, M. Moinpour, D. Hooper and A. Philipossian. International Conference on Planarization/CMP Technology Proceedings, 88-96 (2008).
  • End-Point Detection of Ta/TaN CMP via Shear Force Analysis Y. Sampurno, X. Gu, T. Nemoto, Y. Zhuang, A. Teramoto, A. Philipossian and T. Ohmi. International Conference on Planarization/CMP Technology Proceedings, 132-138 (2008).
  • Quantifying Diamond Disc Loss & Diamond Micro-Wear in Copper CMP. A. Philipossian, X. Wei, A. Meled, Y. Zhuang, L. Borucki, M. Moinpour, and D. Hooper. China Semiconductor Materials International Conference 2008 (CSMIC 2008) Proceedings, (2008).
  • Pattern Evolution Studies in STI CMP via Real-Time Shear and Down Force Spectral Analyses. Y. Sampurno, F. Sudargho, Y. Zhuang, T. Ashizawa, H. Morishima, and A. Philipossian. Chemical-Mechanical Polish for ULSI Multilevel Interconnection Conference (CMP-MIC) Proceedings, 48-53 (2008).
  • Effect of Pad Break-in Time and In-Situ Pad Conditioning Duty Cycle for Porous and Non-Porous Pads in CMP. Y. Sampurno, L. Borucki, S. Misra, K. Holland, Y. Zhuang, and A. Philipossian. Chemical-Mechanical Polish for ULSI Multilevel Interconnection Conference (CMP-MIC) Proceedings, 224-230 (2008).
  • Characterizing Diamond Disc Substrate Loss and Diamond Micro-Wear in Copper CMP. X. Wei, J. Cheng, A. Meled, L. Borucki, Y. Zhuang, M. Moinpour, D. Hooper and A. Philipossian. Chemical-Mechanical Polish for ULSI Multilevel Interconnection Conference (CMP-MIC) Proceedings, 322-327 (2008).
  • Tribological, Kinetic, Thermal and Flow Characteristics of PPS and PEEK Retaining Rings. A. Philipossian, X. Wei, Y. Sampurno, F. Sudargho, Y. Zhuang, C. Wargo and L. Borucki. International Conference on Planarization/CMP Technology Proceedings, 31-35 (2007).
  • Applications of Shear Force Spectral Analysis in STI CMP. Y. Sampurno, F. Sudargho, Y. Zhuang, T. Ashizawa, H. Morishima and A. Philipossian. International Conference on Planarization/CMP Technology Proceedings, 129-133 (2007).
  • Pad Surface Microstructure and Optimization of the Conditioning Sweep. L. Borucki, X. Wei, Y. Zhuang, A. Philipossian and D. Slutz. 2007 International Conference on Planarization/CMP Technology Proceedings, 367-371 (2007).
  • CMP Active Diamond Characterization and Conditioner Wear. L. Borucki, R. Zhuang, Y. Zhuang, A. Philipossian and N. Rikita. Materials Research Society Symposium Proceedings, Vol. 991, C01-01 (2007).
  • Investigation of Diamond Grit Size and Conditioning Force Effect on CMP Pads Topography. T. Sun, L. Borucki, Y. Zhuang and A. Philipossian. Materials Research Society Symposium Proceedings, Vol. 991, C01-07 (2007).
  • Experimental Investigation and Numerical Simulation of Pad Stain Formation during Copper CMP. H. Lee, Y. Zhuang, L. Borucki, F. O’Moore, S. Joh and A. Philipossian. Materials Research Society Symposium Proceedings, Vol. 991, C06-02 (2007).
  • Screening Study on Frictional Force Analysis in Relation to Silica Abrasive and Slurry Properties. Y. Zhuang, Y. A. Sampurno, F. Sudargho, G. Steward, H. Barthel, E. Mayer, T. Gottschalk-Gaudig, M. Stintz, U. Kaetzel, A. Nogowski, M. Goldstein and A. Philipossian. Materials Research Society Symposium Proceedings, Vol. 991, C08-03 (2007).
  • Investigation of Diamond Effect on Pad Topography, Friction Force and Removal Rate during ILD CMP Process. Y. Zhuang, L. Borucki, N. Rikita, F. Sudargho, Y. Sampurno, X. Wei, G. Steward and A. Philipossian. 12th International Conference on Chemical-Mechanical Polish (CMP) Planarization for ULSI Multilevel Interconnection Proceedings, 277-282 (2007).
  • Study of Inhibition Characteristics of Slurry Additives in Copper CMP Using Force Spectroscopy. A. Philipossian, H. Lee, S. V. Babu, U. Patri, Y. Hong, L. Economikos, M. Goldstein, Y. Zhuang and L. Borucki. ECS Transactions, 2(2), 515-522 (2006).
  • Causal Analysis of Conditioner Design Factors on Removal Rates in Copper CMP. L. Borucki, N. Rikita, Y. Zhuang, H. Lee, R. Zhuang, T. Yamashita, R. Kikuma and A. Philipossian. 11th International Conference on Chemical-Mechanical Polish (CMP) Planarization for ULSI Multilevel Interconnection Proceedings, 272-279 (2006).
  • Experimental And Theoretical Investigation of Slurry Chemical And Mechanical Characteristics in Copper Polishing. Y. Zhuang, M. Keswani, L. Borucki, R. Zhuang, M. Lacy, C. Spiro and A. Philipossian. 11th International Conference on Chemical-Mechanical Polish (CMP) Planarization for ULSI Multilevel Interconnection Proceedings, 395-400 (2006).
  • Frictional, Thermal and Kinetic Characterization of a Novel Ceria Based Abrasive Slurry for Silicon Dioxide CMP. Y. Zhuang, L. Borucki, E. Dien, M. Ennahali, G. Michel, B. Laborie, M. Keswani, D. Rosales-Yeomans, H. Lee and A. Philipossian. 11th International Conference on Chemical-Mechanical Polish (CMP) Planarization for ULSI Multilevel Interconnection Proceedings, 532-539 (2006).
  • Asperity Size Distribution near Wafer Features during CMP. C. Gray, C. Rogers, V. Manno, J. Vlahakis, C. Barns, M. Moinpour, S. Anjur, A. Phlipossian and L. Borucki. 11th International Conference on Chemical-Mechanical Polish (CMP) Planarization for ULSI Multilevel Interconnection Proceedings, 593-596 (2006).
  • Study of Inhibition Characteristics of Slurry Additives in Copper CMP Using Force Spectroscopy. M. Keswani, H. Lee, S. V. Babu, U. B. Patri, Y. Hong, L. Economikos, M. Goldstein and A. Philipossian. 2nd PacRim International Conference on Planarization CMP and Its Application Technology Proceedings, 34-39 (2005).
  • Diamond Conditioner Wear Characterization for a Copper CMP Process. L. Borucki, Y. Zhuang, R. Kikuma, N. Rikita, T. Yamashita, K. Nagasawa, M. Keswani, H. Lee, T. Sun, D. Rosales-Yeomans, T. Stout and A. Philipossian. 2nd PacRim International Conference on Planarization CMP and Its Application Technology Proceedings, 147-152 (2005).
  • Experimental and Numerical Analysis of A Novel Ceria Based Abrasive Slurry for Interlayer Dielectric Chemical Mechanical Planarization. Y. Zhuang, L. Borucki, A. Philipossian, E. Dien, M. Ennahali, G. Michel, B. Laborie, M. Keswani, D. Rosales-Yeomans and H. Lee. 2nd PacRim International Conference on Planarization CMP and Its Application Technology Proceedings, 214-219 (2005).
  • Thermal, Tribological, and Removal Rate Characteristics of Pad Conditioning in Copper CMP. H. Lee, D. DeNardis, A. Philipossian, Y. Seike, M. Takaoka, K. Miyachi, S. Furukawa, A. Terada, Y. Zhuang and L. Borucki. 2nd PacRim International Conference on Planarization CMP and Its Application Technology Proceedings, 308-314 (2005).
  • Physics of the Coefficient of Friction in CMP. L. Borucki, Y. Zhuang and A. Philipossian. 2nd PacRim International Conference on Planarization CMP and Its Application Technology Proceedings, 411-416 (2005).
  • Physics and Modeling of Fundamental CMP Phenomena. L. Borucki, A. Philipossian and Y. Zhuang. 22nd International VLSI Multilevel Interconnection Conference Proceedings, 175-180(2005).
  • Implications of Wafer Size Scale-up on Frictional, Thermal and Kinetic Attributes of ILD CMP Process. D. Rosales-Yeomans, L. Borucki, T. Doi, L. Lujan and A. Philipossian. 22nd International VLSI Multilevel Interconnection Conference Proceedings, 188-193 (2005).
  • Measurement of Diamond Conditioner Microwear. L. Borucki, Y. Sampurno, Y. Zhuang, A. Philipossian, T. Merchant and J. Zabasajja. 22nd International VLSI Multilevel Interconnection Conference Proceedings, 441-445 (2005).
  • Effect of Slurry Injection Position on Slurry Mixing, Frictional Forces, Removal Rate and Process Temperature During Copper CMP. Y. Sampurno, L. Borucki and A. Philipossian. 22nd International VLSI Multilevel Interconnection Conference Proceedings, 453-456 (2005).
  • Characterization of Copper-Hydrogen Peroxide Film Growth Kinetics. D. DeNardis, D. Rosales-Yeomans, L. Borucki and A. Philipossian. 22nd International VLSI Multilevel Interconnection Conference Proceedings, 620-624 (2005).

Conference Presentations

  • CMP Conditioner and Pad Characterization. L. Borucki. CMP Users Group - Announcements, Sunnyvale, CA, April 9 (2008).
  • Tribological, Kinetic, Thermal and Flow Characteristics of PPS and PEEK Retaining Rings. A. Philipossian, X. Wei, Y. Sampurno, F. Sudargho, Y. Zhuang, C. Wargo and L. Borucki. International Conference on Planarization/CMP Technology, Dresden, Germany, October 25-27 (2007).
  • Applications of Shear Force Spectral Analysis in STI CMP. Y. Sampurno, F. Sudargho, Y. Zhuang, T. Ashizawa, H. Morishima and A. Philipossian. International Conference on Planarization/CMP Technology, Dresden, Germany, October 25-27 (2007).
  • Pad Surface Microstructure and Optimization of the Conditioning Sweep. L. Borucki, X. Wei, Y. Zhuang, A, Philipossian and D. Slutz. International Conference on Planarization/CMP Technology, Dresden, Germany, October 25-27 (2007).
  • Effect of Wafer Size Scaling on Frictional, Thermal and Kinetic Attributes of CMP Processes. Y. Zhuang, M. Goldstein, A. Philipossian and L. Borucki. 4th ISMI Symposium on Manufacturing Effectiveness, Austin, Texas, October 23-25 (2007).
  • Effect of Concentric Slanted Groove Patterns on Slurry Flow during Copper CMP. D. Rosales Yeomans, H. Lee, T. Suzuki and A. Philipossian. SRC 9th Premier TECHCON, Austin, Texas, September 10-12 (2007).
  • On the Relationship between Contact Area Data and Polishing. L. Borucki, T. Sun, Y. Sampurno, F. Sudargho, X. Wei, Y. Zhuang, S. Anjur and A. Philipossian. 12th International Symposium on Chemical-Mechanical Planarization, Lake Placid, New York, August 12-15 (2007).
  • Effect of Concentric Slanted Groove Patterns on Slurry Flow during Copper CMP. A. Philipossian, D. Rosales Yeomans, H. Lee and T. Suzuki. 12th International Symposium on Chemical-Mechanical Planarization, Lake Placid, New York, August 12-15 (2007).
  • Screening Study on Frictional Force Analysis in Relation to Silica Abrasive and Slurry Properties. Y. Zhuang, Y. A. Sampurno, F. Sudargho, G. Steward, H. Barthel, E. Mayer, T. Gottschalk-Gaudig, M. Stintz, U. Kaetzel, A. Nogowski, M. Goldstein and A. Philipossian. 2007 Materials Research Society Spring Meeting, San Francisco, California, April 9-13 (2007).
  • (Invited Talk): CMP Active Diamond Characterization and Conditioner Wear. L. Borucki, R. Zhuang, Y. Zhuang, A. Philipossian and N. Rikita. 2007 Materials Research Society Spring Meeting, San Francisco, California, April 9-13 (2007).
  • The Effect of Conditioning on Pad Topography and Shear-Induced Flow Resistance during CMP. T. Sun, L. Borucki, R. Zhuang, Y. Zhuang and A. Philipossian. 2007 Materials Research Society Spring Meeting, San Francisco, California, April 9-13 (2007).
  • Experimental Investigation and Numerical Simulation of Pad Stain Formation during Copper CMP. H. Lee, L. Borucki, Y. Zhuang, F. O’Moore, S. Schultz, S. Joh and A. Philipossian. 2007 Materials Research Society Spring Meeting, San Francisco, California, April 9-13 (2007).
  • Application of a Model of Conditioning to a Non-porous Pad Having a Surface Network of Randomized Micron-scale Channels for Chemical Mechanical Planarization. O. Hsu, L. Borucki, Y. Zhuang, R. Zhuang, M. Jin, J. Aldeborgh and A. Philipossian. 2007 Materials Research Society Spring Meeting, San Francisco, California, April 9-13 (2007).
  • (Invited Talk) Investigation of Diamond Effect on Pad Topography, Friction Force and Removal Rate during ILD CMP Process. Y. Zhuang, L. Borucki, N. Rikita, F. Sudargho, Y. Sampurno, X. Wei, G. Steward and A. Philipossian. 12th International Conference on Chemical-Mechanical Polish (CMP) Planarization for ULSI Multilevel Interconnection, Fremont, California, March 5-8 (2007).
  • (Invited Talk): Issues Surrounding Use of Small Wafers to Study the Frictional, Thermal and Kinetic Attributes of CMP Processes. A. Philipossian, Y. Zhuang and L. Borucki. 210th Meeting of The Electrochemical Society, Cancun, Mexico, October 29 - November 3 (2006).
  • Design and Evaluation of Novel Pad Grooves for Copper CMP. D. Rosales-Yeomans, D. DeNardis, L. Borucki and A. Philipossian. 210th Meeting of The Electrochemical Society, Cancun, Mexico, October 29 - November 3 (2006).
  • Analysis of Pads with Slanted Grooves for Copper CMP. D. Rosales-Yeomans, D. DeNardis, L. Borucki, T. Suzuki and A. Philipossian. 210th Meeting of The Electrochemical Society, Cancun, Mexico, October 29 - November 3 (2006).
  • Surface Characterization and Flow Resistance Estimates for CMP Pads. T. Sun, L. Borucki, Y. Zhuang, D. Marks, T. Clark and A. Philipossian. 210th Meeting of The Electrochemical Society, Cancun, Mexico, October 29 - November 3 (2006).
  • Investigation of Pad Stain and Its Effect on Copper Removal Rate. Y. Zhuang, H. Lee, L. Borucki, F. O’Moore, S. Schultz, S. Joh, and A. Philipossian. 11th International Symposium on Chemical-Mechanical Planarization, Lake Placid, New York, August 13-16 (2006).
  • Optical and Mechanical Characterization of CMP Pad Surfaces. L. Borucki, T. Sun, Y. Zhuang, M. Lacy, C. Spiro and A. Philipossian. 11th International Symposium on Chemical-Mechanical Planarization, Lake Placid, New York, August 13-16 (2006).
  • Effect of Conditioning Force on Pad Topography and Removal Rate during Copper CMP. R. Zhuang, L. Borucki, Y. Zhuang, M. Lacy, C. Spiro and A. Philipossian. 11th International Symposium on Chemical-Mechanical Planarization, Lake Placid, New York, August 13-16 (2006).
  • Asperity Size Distribution near Wafer Features during CMP. C. Gray, C. Rogers, V. Manno, J. Vlahakis, C. Barns, M. Moinpour, S. Anjur, A. Phlipossian and L. Borucki. 11th International Conference on Chemical-Mechanical Polish (CMP) Planarization for ULSI Multilevel Interconnection, Fremont, California, February 20-23 (2006).
  • Causal Analysis of Conditioner Design Factors on Removal Rates in Copper CMP. L. Borucki, N. Rikita, Y. Zhuang, H. Lee, R. Zhuang, T. Yamashita, R. Kikuma and A. Philipossian. 11th International Conference on Chemical-Mechanical Polish (CMP) Planarization for ULSI Multilevel Interconnection, Fremont, California, February 20-23 (2006).
  • Experimental And Theoretical Investigation of Slurry Chemical And Mechanical Characteristics in Copper Polishing. Y. Zhuang, M. Keswani, L. Borucki, R. Zhuang, M. Lacy, C. Spiro and A. Philipossian. 11th International Conference on Chemical-Mechanical Polish (CMP) Planarization for ULSI Multilevel Interconnection, Fremont, California, February 20-23 (2006).
  • Frictional, Thermal and Kinetic Characterization of a Novel Ceria Based Abrasive Slurry for Silicon Dioxide CMP. Y. Zhuang, L. Borucki, E. Dien, M. Ennahali, G. Michel, B. Laborie, M. Keswani, D. Rosales-Yeomans, H. Lee and A. Philipossian. 11th International Conference on Chemical-Mechanical Polish (CMP) Planarization for ULSI Multilevel Interconnection, Fremont, California, February 20-23 (2006).
  • (Invited Talk) Study of Inhibition Characteristics of Slurry Additives in Copper CMP Using Force Spectroscopy. M. Keswani, H. Lee, S. V. Babu, U. B. Patri, Y. Hong, L. Economikos, M. Goldstein and A. Philipossian. 2nd PacRim International Conference on Planarization CMP and Its Application Technology, Seoul, Korea, November 17-19 (2005).
  • Diamond Conditioner Wear Characterization for a Copper CMP Process. L. Borucki, Y. Zhuang, R. Kikuma, N. Rikita, T. Yamashita, K. Nagasawa, M. Keswani, H. Lee, T. Sun, D. Rosales-Yeomans, T. Stout and A. Philipossian. 2nd PacRim International Conference on Planarization CMP and Its Application Technology, Seoul, Korea, November 17-19 (2005).
  • Experimental and Numerical Analysis of A Novel Ceria Based Abrasive Slurry for Interlayer Dielectric Chemical Mechanical Planarization. Y. Zhuang, L. Borucki, A. Philipossian, E. Dien, M. Ennahali, G. Michel, B. Laborie, M. Keswani, D. Rosales-Yeomans and H. Lee. 2nd PacRim International Conference on Planarization CMP and Its Application Technology, Seoul, Korea, November 17-19 (2005).
  • Thermal, Tribological, and Removal Rate Characteristics of Pad Conditioning in Copper CMP. H. Lee, D. DeNardis, A. Philipossian, Y. Seike, M. Takaoka, K. Miyachi, S. Furukawa, A. Terada, Y. Zhuang and L. Borucki. 2nd PacRim International Conference on Planarization CMP and Its Application Technology, Seoul, Korea, November 17-19 (2005).
  • Physics of the Coefficient of Friction in CMP. L. Borucki, Y. Zhuang and A. Philipossian. 2nd PacRim International Conference on Planarization CMP and Its Application Technology, Seoul, Korea, November 17-19 (2005).
  • Effect of Slurry Injection Position on Slurry Mixing, Friction, Removal Rate and Process Temperature During Copper CMP. Y. Sampurno, L. Borucki and A. Philipossian. SRC 8th Premier Technical Conference, Portland, Oregon, October 24-26 (2005).
  • Design and Evaluation of Novel Pad Grooves for Effective Control of Slurry Flow during Copper CMP. D. Rosales-Yeomans, L. Borucki, T. Doi, T. Suzuki and A. Philipossian. SRC 8th Premier Technical Conference, Portland, Oregon, October 24-26 (2005).
  • Measurement of Diamond Conditioner Microwear. L. Borucki, Y. Sampurno, Y. Zhuang, A. Philipossian, T. Merchant and J. Zabasajja. 22nd International VLSI Multilevel Interconnection Conference, Fremont, California, October 3-6 (2005).
  • (Invited Talk): Physics and Modeling of Fundamental CMP Phenomena. L. Borucki, A. Philipossian and Y. Zhuang. 22nd International VLSI Multilevel Interconnection Conference, Fremont, California, October 3-6 (2005).
  • Effect of Slurry Injection Position on Slurry Mixing, Friction, Removal Rate and Process Temperature During Copper CMP. Y. Sampurno, L. Borucki and A. Philipossian. 22nd International VLSI Multilevel Interconnection Conference, Fremont, California, October 3-6 (2005).
  • Characterization of Copper-Hydrogen Peroxide Film Growth Kinetics. D. DeNardis, D. Rosales-Yeomans, L. Borucki and A. Philipossian. 22nd International VLSI Multilevel Interconnection Conference, Fremont, California, October 3-6 (2005).
  • Implications of Wafer Size Scale-up on Frictional, Thermal and Kinetic Attributes of ILD CMP Process. D. Rosales-Yeomans, L. Borucki, T. Doi, L. Lujan and A. Philipossian. 22nd International VLSI Multilevel Interconnection Conference, Fremont, California, October 3-6 (2005).
  • Design and Evaluation of Novel Pad Groove Designs for Copper CMP. A. Philipossian, D. Rosales-Yeomans, L. Borucki and T. Suzuki. Northern California Chapter AVS 10th International CMP User Group Symposium, San Jose, California, October 5 (2005).
  • (Invited Talk): Mechanical and Chemical Rate Changes during CMP Tool Scale-up. L. Borucki, D. Rosales-Yeomans and A. Philipossian. 10th International Symposium on Chemical-Mechanical Planarization, Lake Placid, New York, August 14-17 (2005).
Services