Tel: 520.465.1419
E-mail : araca@aracainc.com
Founded in 2004 and headquartered in Tucson, AZ (USA), Araca Inc. provides unique, enabling, and fully customized solutions to our clients in IC planarization and semiconductor polishing. Clients include leading IC makers, consumables suppliers, OEMs, universities, and research centers. Our products lower the cost of ownership (COO) of CMP or polishing modules, allowing clients to save money and preserve the environment by reducing slurry and rinse water consumption, increasing pad and diamond disc life, while increasing polisher availability, throughput, and yield.
Flucto-CMP® and the Slurry Injection System (SIS®) are compatible with all polishers. SIS® continues to be rapidly adopted in HVM due to its proven COO and environmental benefits, while Flucto-CMP® is undergoing extensive beta-testing at a major OEM. We provide sensorized and affordable polishers-tribometers and PVA brush scrubbers-tribometers (up to 300 mm wafers), which offer significant reductions in process and consumables characterization costs and R&D expenses. CARE-TEC® is our revolutionary SiC and GaN final polishing system; it requires no slurry or conditioning disc.
In our Class 100 clean room at the University of Arizona, we provide research and foundry services for all sizes and types of substrates. We perform high-quality and highly scientific analytical and functional tests on pads, slurries, conditioners, retaining rings, brushes, and cleaning chemicals. Our pad surface preparation and grooving services are second to none. We develop customized CMP, polishing, and cleaning consumables and processes for various applications, including SiC and GaN, and remain open to co-development programs. We also offer delayering services for 3D NAND and DRAM structures for diagnostics.